Cutting
After the growth, the crystal needs to cut in desired size according to the end use. For electronic or optoelectronic purpose, the crystals are cut into thin wafers of thickness 300 to 500 microns. For optical applications the crystals are cut into blocks of size few millimeter to few centimeters, sometimes in tens of centimeters. Generally two types of sawing machines are used for this purpose. One is the wire saw, and the other is the disc saw.  In both types of saws the wire (or the cutting edge of the disc) are impregnated with diamond powder. A good crystal cutter has features such variable speed and tension, and are equipped with a goniometer. The purpose of the goniometer is to cut the crystal at any desired angle.
     
        disc saw                        wire saw